Description

U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865

Name: U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865
SKU: 4117
Availability: InStock

Reviews

There are no reviews yet.

Be the first to review “U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865”

Mobile Phone Repair Tools, IC & Parts Wholeseller.

U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865

Description

U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865

Reviews

Support

Account

Quick Link

Scan & join

U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865

Description

U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865

Reviews

Related products

Amaoe BS1 BGA Reballing Stencil for Black Shark 3 3Pro 3S 4 4Pro 4S Snapdragon 865 870 888 SM8250 8350 Tin Planting Net 0.12MM

MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh

AMAOE IPXS-A12 FOR IPXS/MAX/XR STENCIL

Amaoe CPU NAND Power Amplifier IC A17 A16 BGA Reballing Stencil Kits Set For iPhone 15 Pro Max Plus 15Pro 15ProMax 15Plus