“MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh” has been added to your cart. View cart
U-QSD9 BGA Reballing Solder Template Stencil For Snapdragon 865/870/MSM8250/PM8250/8150/QCA6391/SDX55M/SDR865
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