Description
Product details of RELIFE F-21 BGA Advanced Hydrogenated Solder Paste Flux 10CC No-Clean Solder Paste Flux For Mobile Phone Repair updrade from F-20
- • RELIFE F-21 BGA Advanced Hydrogenated Solder Paste Flux 10CC
- • No-Clean Solder Paste Flux for Mobile Phone Repair
- • Upgraded version of F-20
- • Suitable for BGA soldering
- • Category: Tools, DIY & Outdoor>Hand Tools>Fastening, Gluing & Soldering
This RELIFE F-21 BGA Advanced Hydrogenated Solder Paste Flux is a must-have for mobile phone repair and upgrade enthusiasts. With a 10CC capacity, this no-clean solder paste flux is perfect for precise and intricate soldering tasks. Its advanced hydrogenated formula ensures a strong and reliable bond, while its no-clean feature saves you time and effort in the cleaning process. This solder paste flux is an essential tool for any DIY or professional
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