RELIFE RL-404 Solder Flux Lead-free Low Temperature 138℃ Tin Paste for Mobile Phone PCB BGA/SMD Motherboard Welding Fluxes

400.00৳ 

Description

Product details of RELIFE RL-404 Lead-free Low Temperature Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA/SMD Welding Fluxes

  • Relife Solder Paste Flux 138°C Low Temp
  • Solder Paste Flux 138C Relife Low Temp Welding Fluxes Liquid Advance 40g Suitable for iPhone BGA Solder Flux Repair
  • 138℃ low temperature
  • Tin lighting / strong tin climbing / high purity / easy to store
  • 138℃ low temperature tin paste
  • Low temperature lead-free solder paste
  • customized for high-end machine motherboard repair
  • Lead-free environmental protection
  • High_purity
  • Delicate stickiness
  • 138℃ low melting point
  • The temperature is accurate, the tin is lit, and the circuit board components are effectively protected
  • High resistance, strong tin climbing
  • Reduce the difficulty of maintenance and reduce the risk of component loss
  • Pure ingredients, fine paste
  • The alloy composition is pure / delicate and sticky / plant tin does not bubbling / silver bright spots are good

Reviews

There are no reviews yet.

Be the first to review “RELIFE RL-404 Solder Flux Lead-free Low Temperature 138℃ Tin Paste for Mobile Phone PCB BGA/SMD Motherboard Welding Fluxes”

Your email address will not be published. Required fields are marked *