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MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh

Name: MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh
SKU: 3942
Availability: InStock

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MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh

Description

MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh

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MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh

Description

MI12 SM8250 CPU QCA6391 PMX55 SDX55M 78190-31 BGA Reballing Stencil FOR Redmi K30 Pro Xiaomi 10/10 Pro plant tin net Steel mesh

Reviews

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