Description

Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness

Name: Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness
SKU: 4079
Availability: InStock

Reviews

There are no reviews yet.

Be the first to review “Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness”

Mobile Phone Repair Tools, IC & Parts Wholeseller.

Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness

Description

Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness

Reviews

Support

Account

Quick Link

Scan & join

Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness

Description

Amaoe U-MIXU1 BGA Reballing Solder Stencil for A17/HI36A0/SM8650/6450/MT6985W/6989W Steel Mesh 0.12mm Thickness

Reviews

Related products

RELIFE RL-601M 9in1 Universal CPU Reballing Stencil Platform For iPhone 6-12 Pro Max IC Chip Planting Tin Template Fixture Tools

MI13 SM7225 MT6769V SM6115 CPU MT6358VW PMI632 PM6150L BGA Reballing Stencil For Redmi 9/Note9 4G/Note9 Pro Steel mesh repair

AMAOE IP14-A16/A15 FOR IP14/PLUS/PRO/MAX STENCIL

MI14 BGA Reballing Stencil For Xiaomi 11 U Pro 11Ultra 11Pro 11i 11XPro Redmi K40Pro CPU SM8350 RAM 77033 77040 PM8350 PM8350C