Description

Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550

Name: Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550
SKU: 4020
Availability: InStock

Reviews

There are no reviews yet.

Be the first to review “Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550”

Mobile Phone Repair Tools, IC & Parts Wholeseller.

Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550

Description

Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550

Reviews

Support

Account

Quick Link

Scan & join

Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550

Description

Amaoe QU9 0.12mm Qualcomm CPU Series BGA Reballing Stencil for SM8750 SM8635 SM8650 SM8550 SM8450 SM7550

Reviews

Related products

MI13 SM7225 MT6769V SM6115 CPU MT6358VW PMI632 PM6150L BGA Reballing Stencil For Redmi 9/Note9 4G/Note9 Pro Steel mesh repair

Amaoe BS1 BGA Reballing Stencil for Black Shark 3 3Pro 3S 4 4Pro 4S Snapdragon 865 870 888 SM8250 8350 Tin Planting Net 0.12MM

EU5 BGA Stencil Reballing For Samsung 3830 XGO Exynos 1080 2100 9815 9609 8895-1703 RAM Chip Solder Steel Mesh IC Tin Planting

AMAOE GLE:1 BGA Reballing Solder Template Stencil For GLE1 Google Pixel CPU Google Tensor