“16 Series A18 A18Pro BGA Reballing Stencil 0.12mm Plant Tin Steel Mesh for iPhone 16 16Plus 16Pro 16ProMax IC Soldering” has been added to your cart. View cart

Amaoe QU5 BGA Reballing Stencil Template For SDM710 SDM845 SDM670 SM6150 MSM8917 SM8150 Qualcomm CPU RAM Chip IC Steel Mesh

180.00৳

Category: BGA Stencil

Description
Reviews (0)

Description

Amaoe QU5 BGA Reballing Stencil Template For SDM710 SDM845 SDM670 SM6150 MSM8917 SM8150 Qualcomm CPU RAM Chip IC Steel Mesh

Send via WhatsApp

Mobile Phone Repair Tools, IC & Parts Wholeseller.

Amaoe QU5 BGA Reballing Stencil Template For SDM710 SDM845 SDM670 SM6150 MSM8917 SM8150 Qualcomm CPU RAM Chip IC Steel Mesh

Description

Amaoe QU5 BGA Reballing Stencil Template For SDM710 SDM845 SDM670 SM6150 MSM8917 SM8150 Qualcomm CPU RAM Chip IC Steel Mesh

Reviews

Support

Account

Quick Link

Scan & join

Amaoe QU5 BGA Reballing Stencil Template For SDM710 SDM845 SDM670 SM6150 MSM8917 SM8150 Qualcomm CPU RAM Chip IC Steel Mesh

Description

Amaoe QU5 BGA Reballing Stencil Template For SDM710 SDM845 SDM670 SM6150 MSM8917 SM8150 Qualcomm CPU RAM Chip IC Steel Mesh

Reviews

Related products

MI14 BGA Reballing Stencil For Xiaomi 11 U Pro 11Ultra 11Pro 11i 11XPro Redmi K40Pro CPU SM8350 RAM 77033 77040 PM8350 PM8350C

AMAOE IP8-A11 FOR IP8/PLUS/X STENCIL

AMAOE IP 6/6P-A8 STENCIL

MI15 BGA Stencil Reballing For Xiaomi 12 Pro 12X 12Pro SM8250 SM8450 CPU RAM PM8450 PM8350 PM8350C PM8250 PM8150A QCA6391 SDX55M