RELIFE RL-601M 8 in 1 Universal CPU Reballing Stencil Platform For iPhone 6-13/13 Pro Max IC Chip Planting Tin Template Fixture

Relife RL-601M 8 in 1 Universal CPU Reballing Stencil Platform For A8-A15 IC Chip Planting Tin

Features:

• Universal weighted non-slip base/with 8 tin planting nets/positioning/gluing removal/ tin planting integrated
• Suitable for A8/A9/A10/A11/A12/A13/A14/A15 lower layer

• Precise positioning/Fast tin planting/Strong magnetic adsorption/Foolproof design

• You can directly and accurately align the tin planting net to the fixture, which is convenient and quick

• Imported steel, round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls

• Built-in High-temperature resistance magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged

Specification:

• Brand: RELIFE
• Product name: IP CPU tin planting set

• Model: RL-601M

• Net weight: About 190g

• Gross weight: About 225g/Box

• Product size: 60*80*16.8mm

• Package size: 116*93″25mm/Box

• Steel mesh thickness: 0.12mm

• Configuration: Fixture*1/Steel mesh*8

Package includes:

• 1 x Stencil Platform
• 8 x Steel mesh