RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair
RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair - Image 2
RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair - Image 3
  1. RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair
  2. RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair - Image 2
  3. RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair - Image 3

RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair

350.00৳ 

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Description

RELIFE F-20 10CC Advanced hydrogenated No-Clean solder flux for BGA Reballing ball rework BGA PCB SMD Rework Repair Tool

 

Introduction:

 

1.Japanese hydrogenated rosin raw materials, high-definition transparent, without any impurities

2.Good lubricity, provide excellent wettability, strong stability

3.Hydrogenated and transparent, effectively reduce welding defects and reduce voids

4.Environmentally and slight smoke, no irritating odor

5.New integrated press packaging design, leading the trend

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