3, blow welding with plastic components, ringer, insert the end of the inline blocks and other non-deformation, blow welding circuit board not sparkling. Demolition of the shield does not change color
4, blowing BGA chip easily broken.
Closed loop sensor:
Temperature can be controlled by zero volage triggering mode.
Large power and rapid heating:
Temperature can be conveniently adjusted and the temperature is accurate and stabe, and not affected by airflow.
Stepless airflow adjusting with wide range:
Temperature can be conveniently adjusted.
Sensitive electromagnetic inductor in handle:
Ensures the unit beginning working immediately so long as the handle is held.when handle is put on the holder, the system will return back to standby mode. easy to use.
Automatic cooling system:
Can increase the life of heating element and protect the unit.
Compact unit takes up little space on the workbench.
Fits most of SMD,SUCH SOIC,CHIP,QFP,PLCC,BAG ETC.
It is fuitable to hot shrink, drying, remove lacquer and mucosity, thaw, preheating, disinfect and so on.
Power consumption: 580W with four round air nozzles
Pump: DC motor, twin-turbo rotate out of the wind.
Temperature adjustment: 100-480℃
Gas flow: 100 l / min
Nozzle Diameter: 3mm 6mm 8mm 12mm